The present invention relates to a method of manufacturing a surface mount package for use in an integrated circuit by heating a ball grid array (BGA), which is a type of a surface mount package, for de-soldering or repairing or repairing chips mounted on a printed circuit board More particularly, to a rework (rework) system for performing a soldering operation, and more particularly, to a method and a system for performing a soldering operation on a residue of a pick-up semiconductor chip necessary for implementing an automated BGA lithography ) Is removed from the PCB automatically. A BGA rework system according to the present invention is for removing a solder residue after lifting a semiconductor chip from a PCB to be repaired, the absorber having a size corresponding to a size of the semiconductor chip separation area of the PCB; And a heating member for melting the residue remaining on the PCB.
展开▼
