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Dielectric Substance-Electrode Assembly And Method For Manufacturing Dielectric Substance-Electrode Assembly

机译:电介质Substance-Electrode组装和方法制造业介电Substance-Electrode组装

摘要

Disclosed are an assembly of a dielectric and an electrode in which an electrode is coated with a dielectric, and a method for manufacturing the same. The dielectric and electrode assembly forms a lower dielectric electrode forming the lower portion of the assembly body, sealing the lower dielectric electrode formed with the electrode and the capsule filled with the target powder, and placing the sealed capsule in the pressure vessel of the heat treatment device sintering heat treatment is applied by applying isotropic pressure, and the powder to be treated is diffusion bonded to the lower dielectric and the surface of the electrode by the sintering heat treatment to form an upper dielectric forming the upper part of the assembly body.
机译:

著录项

  • 公开/公告号KR102416778B1

    专利类型

  • 公开/公告日2022-07-06

    原文格式PDF

  • 申请/专利权人 한국생산기술연구원;

    申请/专利号KR20200158064

  • 发明设计人 이택우;권오형;김형균;

    申请日2020-11-23

  • 分类号H01L21/683;B23Q3/15;H01L21/67;H01L21/687;H02N13;

  • 国家

  • 入库时间 2023-06-25 23:59:11

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