MALEIMIDE RESIN, ASYMMETRIC BISMALEIMIDE COMPOUND, CURABLE COMPOSITION, CURED OBJECT, SEMICONDUCTOR-ENCAPSULATING MATERIAL, SEMICONDUCTOR-ENCAPSULATING DEVICE, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM

摘要

The present invention provides: a maleimide resin and a maleimide compound which are characterized by being a product of maleimidization of a polyamine compound (C) which is a product of reaction between a plurality of aromatic monoamine compounds (A) and a binder (B); a curable composition containing either of these; a cured object formed from the curable composition; a semiconductor-encapsulating material; a semiconductor-encapsulating device; a prepreg; a circuit board; and a build-up film. The maleimide resin and the maleimide compound not only are low in melting point and softening point and have excellent handleability, but also give cured objects having high heat resistance and are suitable for use as or in semiconductor-encapsulating materials, etc.