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MULTI-DIE CO-PACKED MODULE AND MULTI-DIE CO-PACKING METHOD
MULTI-DIE CO-PACKED MODULE AND MULTI-DIE CO-PACKING METHOD
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机译:MULTI-DIE CO-PACKED模块和MULTI-DIE曾方法
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摘要
A multi-die co-packed module with an embedded die embedded in a substrate, an electrical component mounted above the substrate, and a flip chip die placed between the substrate and the electrical component or below the substrate. The package is compact and low cost.
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