THREE-DIMENSIONAL IMAGING METHOD AND METHOD BASED ON LIGHT FIELD CAMERA AND THREE-DIMENSIONAL IMAGING MEASURING PRODUCTION LINE

摘要

A three-dimensional imaging system and system based on a light field camera and a three-dimensional imaging measuring production line, including a moving mechanism (101), a light source (201,202,203), a light field camera or a linear array light field camera (100), and a chip detection system and detection production line based on the light field camera and a two-dimensional camera. Images are obtained separately by multiple times of scanning by the light field camera or the linear array light field camera (100) and are further spliced to obtain a high resolution light field multi-view image, such that a better three-dimensional imaging result is obtained, thereby improving the measuring precision. Defects such as no wire, broken wire, upward foot and wire deviation and the like can be realized by using a solder ball of a chip shot and detected by the two-dimensional camera in combination with a gold wire of the chip shot and detected by the light field camera. The falling defect of the gold wire of the chip can be detected by analyzing the height of the wire.