ACCOMPANYING BACKING PLATE FOR SOLDER-RESISTING DEVELOPMENT OF ULTRA-THICK PCB

摘要

The present application relates to an accompanying backing plate for solder-resisting development of an ultra-thick PCB. The backing plate comprises a bottom plate and a support frame arranged on the bottom plate; middle parts of the bottom plate and the support frame are provided with a first rectangular through hole and a second rectangular through hole which are in communication with each other; the diagonal of the first rectangular through hole and the second rectangular through hole is slightly shorter than the diagonal of the ultra-thick PCB; the support frame is provided with an annular fixing groove; the fixing groove is arranged around the second rectangular through hole; and the width of the fixing groove is 4-6 mm. The accompanying backing plate for solder-resisting development of the ultra-thick PCB of the present application is provided with the annular fixing groove on the support frame, the ultra-thick PCB is placed through the fixing groove, and in a solder-resisting development process, the ultra-thick PCB is transported and processed together with the accompanying backing plate for solder-resisting development of the ultra-thick PCB, thereby realizing the backing of the ultra-thick PCB, greatly reducing the impact on the bottom surface of the ultra-thick PCB by a roller in a development process, and improving the production quality of products.