Copper/ceramic bonded body, insulated circuit board, and copper/ceramic bonded body manufacturing method, insulated circuit board manufacturing method

摘要

This copper/ceramic bonded body 10 is formed by bonding copper members 12 and 13 made of copper or a copper alloy and a ceramic member 11 made of nitrogen-containing ceramics, and the copper members 12 and 13 and ceramics. Between the members 11, an active metal nitride layer 41 containing a nitride of at least one active metal selected from Ti, Zr, Nb, and Hf is formed on the ceramic member 11 side, and this active metal nitride An Mg solid solution layer 45 in which Mg is dissolved in a matrix of Cu is formed between the layer 41 and the copper members 12 and 13, and in the active metal nitride layer 41, Cu particles and Cu are active Cu-containing particles 42 composed of either one or both of the metal compound particles are dispersed.