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Method of purifying and recycling normal-pressure waste hydrogen by full temperature range pressure swing adsorption (FTrPSA) in manufacturing process of semiconductor
Method of purifying and recycling normal-pressure waste hydrogen by full temperature range pressure swing adsorption (FTrPSA) in manufacturing process of semiconductor
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机译:半导体制造过程中利用全温变压吸附净化和回收常压废氢的方法
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摘要
Through the procedures of pretreatment, temperature swing adsorption (TSA) coarse desorption, pressure swing adsorption (PSA) purification and hydrogen purification, the hydrogenous waste gas from various procedures in the manufacturing process of semiconductor (especially silicon wafer), including the off-gas from chemical vapor deposition (CVD), doping (diffusion and ion implantation), photolithography and cleaning, the combusted and washed discharged gas of the off-gas in other procedures after field treatment and centralized treatment, or the hydrogenous waste gas entering the hydrogen discharge system are purified to meet the standard for the electronic grade hydrogen required for the manufacturing process of semiconductor, the recycling of hydrogen resources is realized, and the yield of hydrogen is greater than or equal to 70-85%. The present invention solves the technical difficulty the normal-pressure waste hydrogen recovered in the manufacturing process of semiconductor can't be returned to the manufacturing process of semiconductor for reuse.
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