PROCESSING METHOD FOR HIGH-SPEED PHOTOELECTRIC COUPLING MODULE PRINTED PLUG PCB

摘要

A processing method for a high-speed photoelectric coupling module printed plug PCB comprises the following steps: photoelectric coupling module PCB → inner layer → lamination → edge milling → drilling → plating → outer circuit → AOI scan → wet film circuit → thick gold dry film → nickel and gold plating → film removal → film attachment → exposure → alkaline etching → AOI scan → solder resist → legend → surface finish → forming → electrical test → finished product inspection. After an inner pull wire is plated with nickel and gold, etching is performed on the wire, thereby implementing a process of covering four sides of edge connectors of the photoelectric coupling module PCB with nickel and gold, enabling a product to pass a mixed flowing gas (MFG) test and a salt spray test, and providing a processing method that improves product quality.