Method for manufacturing a modified integral backing plate

摘要

The present invention relates to a modified integral backing plate manufacturing method, and in particular, by reusing a split backing plate previously used for mounting a target to manufacture an integral backing plate, time, effort and cost for manufacturing a backing plate can be saved. By processing so that the lower end is formed on the side of the integrated backing plate, a planar target can be configured even when targets having different thicknesses are mounted, thereby improving the sputtering efficiency In the modified integrated backing plate manufacturing method it's about In the method for manufacturing a modified integrated backing plate by combining at least two used divided backing plates, the constituent means of the present invention comprises: cleaning the used divided backing plate to be joined; A cleaning step, a welding step of contacting the cleaned and used split backing plate and integrally combining them through electron beam welding, a step processing step of lowering the height of the side so that a step is formed in the integrally coupled integral backing plate, the step difference and a flatness correction step of correcting the flatness of the processed integral backing plate.