首页> 外国专利> MATERIAL FOR CONTACT AND CONTAINING AG ALLOY AS MAIN COMPONENT, CONTACT USING SAID MATERIAL FOR CONTACT, AND ELECTRICAL DEVICE

MATERIAL FOR CONTACT AND CONTAINING AG ALLOY AS MAIN COMPONENT, CONTACT USING SAID MATERIAL FOR CONTACT, AND ELECTRICAL DEVICE

机译:以银合金为主要成分的触头材料,使用该触头材料的触头,以及电气装置

摘要

A contact material reducing movement of oxides even when an arc is generated at the time of contact opening/closing to make the contacts less likely to be damaged is provided. A contact material mainly composed of an Ag alloy, includes: an Ag alloy; and at least one main additive existing as a phase different from the Ag alloy and selected from the group consisting of tin oxide, nickel, nickel oxide, iron, iron oxide, tungsten, tungsten carbide, tungsten oxide, zinc oxide, and carbon, wherein when a metal atom constituting the main additive or the main additive is carbon, the Ag alloy contains a solid solution element having a vacancy binding energy lower than a vacancy binding energy that is a binding energy between the metal atom included in the main additive and a vacancy in an Ag metal, or a binding energy between carbon included in the main additive of carbon and a vacancy in an Ag metal, in an amount of 0.01 wt.% or more.
机译:本发明提供了一种触头材料,即使在触头打开/关闭时产生电弧,也能减少氧化物的移动,从而降低触头损坏的可能性。一种主要由银合金构成的触头材料,包括:银合金;以及至少一种主要添加剂,其以不同于所述银合金的相的形式存在,并且选自氧化锡、镍、氧化镍、铁、氧化铁、钨、碳化钨、氧化钨、氧化锌和碳,其中当构成所述主要添加剂或主添加剂的金属原子为碳时,所述银合金包含空位结合能低于空位结合能的固溶体元素,所述空位结合能是包括在主添加剂中的金属原子与银金属中的空位之间的结合能,或包括在碳的主添加剂中的碳与银金属中的空位之间的结合能,其量为0.01 wt.%或更大。

著录项

  • 公开/公告号EP3978638A1

    专利类型

  • 公开/公告日2022-04-06

    原文格式PDF

  • 申请/专利权人 OMRON CORPORATION;

    申请/专利号EP20200813624

  • 申请日2020-05-29

  • 分类号C22C5/06;C22C32;C22C1/04;

  • 国家 EP

  • 入库时间 2022-08-25 00:21:27

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