Copper-based composite material with high thermal conductivity and adjustable thermal expansion and its manufacturing method

摘要

PROBLEM TO BE SOLVED: To provide a series of thermal expansion adjustable copper-based / negative thermal expansion particle reinforced composite materials which can be used in a range of −160 to 400 ° C. with perfect density and high thermal conduction, and a method for producing the same. SOLUTION: The Cu substrate and the reinforcing body particles of negative thermal expansion are used in a constant molar ratio, and are manufactured by a copper plating coating or a direct composite method. The composite material is completely dense and has high thermal conductivity, has a wide temperature range, has the characteristics of adjustable thermal expansion, and the Cu / ScF3 copper-based / particle-reinforced composite material with a molar ratio of 1 to 6: 1 is -50 to 400 ° C. The average coefficient of thermal expansion in the temperature range is -0.5 x 10-6 / K to 7 x 10-6 / K, and its room temperature thermal conductivity reaches 40 to 190 W / m · K. It can be used in the fields of advanced technology such as new energy vehicles, microelectronic packaging, and precision machinery. [Selection diagram] Fig. 3