首页> 外国专利> YIELD RATE PREDICTION METHOD, YIELD RATE PREDICTION SYSTEM AND MODEL TRAINING DEVICE OF SEMICONDUCTOR MANUFACTURING PROCESS

YIELD RATE PREDICTION METHOD, YIELD RATE PREDICTION SYSTEM AND MODEL TRAINING DEVICE OF SEMICONDUCTOR MANUFACTURING PROCESS

机译:半导体制造过程的成品率预测方法、成品率预测系统和模型训练装置

摘要

A yield rate prediction method, a yield rate prediction system, and a model training device of a semiconductor manufacturing process are provided. The yield rate prediction method of a semiconductor manufacturing process includes the following steps. A correspondence relation between a circuit path of a netlist and an integrated circuit layout is established. Several defective points on several stacking layers are obtained. A recognition model is trained to recognize a fault occurred on the circuit path according to the defective points. A probability of the fault occurred on the circuit path of a semiconductor semi-final product according to the recognition model is recognized. A yield rate of the semiconductor semi-final product is predicted according to the probability.
机译:本发明提供了一种半导体制造过程的成品率预测方法、成品率预测系统和模型训练装置。半导体制造工艺的产率预测方法包括以下步骤。建立了网表电路路径与集成电路版图的对应关系。在几个堆叠层上获得了几个缺陷点。训练识别模型,根据故障点识别电路路径上发生的故障。根据识别模型,识别半导体半成品电路路径上发生故障的概率。根据概率预测半导体半成品的产率。

著录项

  • 公开/公告号US2022076146A1

    专利类型

  • 公开/公告日2022-03-10

    原文格式PDF

  • 申请/专利权人 UNITED MICROELECTRONICS CORP.;

    申请/专利号US202017072073

  • 发明设计人 SHIH-FANG HONG;

    申请日2020-10-16

  • 分类号G06N5/04;G06N20;

  • 国家 US

  • 入库时间 2022-08-24 23:48:30

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