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Comolded non-destructive inspection standard functioning as a bond bump
Comolded non-destructive inspection standard functioning as a bond bump
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机译:COMOLDED非破坏性检查标准作为债券凸点
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摘要
An inspection feature for an adhesive bond portion between parts of a component comprising the inspection feature extending from a surface of the part of the component a predetermined bond line thickness, the inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.
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