A substrate plating method includes forming a first resist film exposing a first feeding layer on a first face of a substrate; forming a second resist film exposing a second feeding layer on a second face of the substrate opposite to the first face; holding the substrate with a clamp member in such a manner that the clamp member is in contact with the first feeding layer and the second feeding layer, and arranging a first electrode in opposed relation with the first face and a second electrode in opposed relation with the second face; and forming a plating layer on a plating-scheduled region of the first face under conditions in which a value of current supplied between the second face and the second electrode is larger than a value of current supplied between the first face and the first electrode.
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