ELECTRONIC BUILDING AND PROCEDURE FOR THE PRODUCTION OF AN ELECTRONIC BUILDING

摘要

The invention relates to an electronic component (1), comprising: a support (2) having a cover surface (2a), a semiconductor chip (3) arranged on the cover surface (2a) of the support (2), and an adhesion promoter layer (4) which connects the semiconductor chip (3) and the support (2) in an electrically conductive manner, the adhesion promoter layer (4) having wires (5). Furthermore, a method for producing an electronic component (1) is disclosed.