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Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device
Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device
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机译:功率半导体器件,制造功率半导体器件的方法和电力转换装置
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摘要
In a power semiconductor device, power semiconductor elements are mounted on a large die pad and the like. The large die pad is joined to a power lead via a lead stepped portion. The large die pad has a first end portion and a second end portion located with a distance therebetween in the X axis direction. In the Y axis direction, the lead stepped portion is joined to the first end portion side relative to a central line between the first end portion and the second end portion. The large die pad is inclined such that a distance between the large die pad and the first main surface of the molding resin is longer from the first end portion toward the second end portion.
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