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IGBT DEVICE BACKSIDE STRUCTURE AND PREPARATION METHOD THEREFOR, AND IGBT DEVICE

机译:IGBT器件背面结构及其制备方法和IGBT器件

摘要

Provided in the present disclosure are an IGBT device backside structure and a preparation method therefor, and an IGBT device, the IGBT device backside structure comprising a buffer layer, the buffer layer comprising a first activation efficiency buffer area corresponding to an active area of the IGBT device and a second activation efficiency buffer area corresponding to a terminal area of the IGBT device, the activation efficiency of the first activation efficiency buffer area being less than the activation efficiency of the second activation efficiency buffer area.
机译:本公开中提供的是IGBT器件背面结构和其制备方法,以及IGBT器件,IGBT器件背面结构包括缓冲层,缓冲层包括对应于IGBT的有源区域的第一激活效率缓冲区区域 装置和第二激活效率缓冲区对应于IGBT器件的终端区域,第一激活效率缓冲区的激活效率小于第二激活效率缓冲区的激活效率。

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