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SUB MICRON PARTICLE DETECTION ON BURL TOPS BY APPLYING A VARIABLE VOLTAGE TO AN OXIDIZED WAFER
SUB MICRON PARTICLE DETECTION ON BURL TOPS BY APPLYING A VARIABLE VOLTAGE TO AN OXIDIZED WAFER
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机译:通过将可变电压施加到氧化晶片上的伯微米粒子检测
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摘要
Systems, apparatuses, methods, and computer program products are provided for determining a free form flatness of a substrate table. An example system can include a substrate table that includes a first substrate table surface and a grounded substrate table electrical connection configured to ground the substrate table. The system can further include a substrate that includes a semiconducting layer, a thermally-grown insulating layer, a first substrate surface disposed on the insulating layer, and a substrate electrical connection configured to transmit a voltage to the semiconducting layer. The system can further include a metrology system configured to apply a voltage to the substrate electrical connection to electrostatically clamp the substrate to the substrate table, measure a flatness of the first substrate surface, and determine a free form flatness of the first substrate table surface based on the measured flatness of the first substrate surface.
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