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NICKEL COLLOID CATALYST SOLUTION FOR ELECTROLESS NICKEL OR NICKEL ALLOY PLATING USE, ELECTROLESS NICKEL OR NICKEL ALLOY PLATING METHOD, AND METHOD FOR MANUFACTURING NICKEL- OR NICKEL-ALLOY-PLATED SUBSTRATE
NICKEL COLLOID CATALYST SOLUTION FOR ELECTROLESS NICKEL OR NICKEL ALLOY PLATING USE, ELECTROLESS NICKEL OR NICKEL ALLOY PLATING METHOD, AND METHOD FOR MANUFACTURING NICKEL- OR NICKEL-ALLOY-PLATED SUBSTRATE
A uniform and even nickel or nickel alloy coating film is obtained by: bringing a non-conductive substrate into contact with a solution containing an adsorption enhancer comprising a surfactant to enhance the adsorption performance of the non-conductive substrate and thereby enhancing the catalytic activity of the non-conductive substrate; then applying a catalyst to the non-conductive substrate by using a nickel colloid catalyst solution for electroless nickel or nickel alloy plating use, said solution comprising (A) a soluble nickel salt, (B) a reducing agent, (C) a prescribed colloid stabilizer such as a polycarboxylic acid or an oxycarboxylic acid, and (D) a prescribed synthetic water-soluble polymer such as a polyvinylpyrrolidone or a polyethylenimine, and having excellent long-term stability; and then performing an electroless nickel or nickel alloy plating procedure.
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