HALF-LEATHER BUILDING EQUIPMENT WITH WATER FROM HARD MATERIALS ISSUED IN MOTOR HECKS WITH WATER FROM WEIGHT MATERIALS

摘要

A stacked semiconductor device encompasses a mother-plate (81) having a mounting-main surface and a bottom-main surface, an onboard-element (Xij) having a connection face facing to the mounting-main surface, a parent bump (11, 14a, 14b, 15, 16, 31+32+33) provided on the mother-plate (81), having a mother-site wall made of a layer of conductor, the mother-site wall being perpendicular to the mounting-main surface, and a repair bump (21+22+23, 24+25+26, 27+28(+29), 41) provided on the onboard-element (Xij) at a side of the connection face, having a repair-site wall made of a layer of conductor having different hardness from the mother-site wall, the repair-site wall being perpendicular to the connection face, the repair bump (21+22+23, 24+25+26, 27+28(+29), 41) and the parent bump (11, 14a, 14b, 15, 16, 31+32+33) being configured to bite each other at an intersection between the mother-site wall and the repair-site wall conductor. At least one of the mother-site and repair-site walls may include a laminated structure of two or more conductive layers (21, 22, 23, 24, 25, 26, 27, 28, 29, 31, 32, 33), adjacent conductive layers (21, 22, 23, 24, 25, 26, 27, 28, 29, 31, 32, 33) in the laminated structure having different hardness. The crimping process of the repair bump (21+22+23, 24+25+26, 27+28(+29), 41) and the parent bump (11, 14a, 14b, 15, 16, 31+32+33) can be achieved with a relatively small pressure, the crimping can thus suppress the deformation of most portions of bumps (11, 14a, 14b, 15, 16, 31+32+33; 21+22+23, 24+25+26, 27+28(+29), 41) other than the portions at solid-phase diffusion bonding. Consequently, after the crimping process with weak force so as to establish a provisional connection, and after electrical evaluation, if there is a defect, the defective onboard-component (2) can be replaced with a further onboard-component (2) and another provisional connection may be executed again with less deformed portions of bumps (11, 14a, 14b, 15, 16, 31+32+33; 21+22+23, 24+25+26, 27+28(+29), 41), wherein this process may be repeated until electrical evaluation test is passed. Non-provisional (final) joining may then be performed upon application of increased pressure.