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Tubular heat spreaders for memory modules and memory modules incorporating the same
Tubular heat spreaders for memory modules and memory modules incorporating the same
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机译:用于内存模块和内存模块的管状散热器并包含相同的内存模块
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摘要
Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.
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