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AROMATIC POLYESTER-CONTAINING CURABLE RESIN COMPOSITION CURED PRODUCT ELECTRIC AND ELECTRONIC COMPONENT AND CIRCUIT BOARD

机译:含芳族聚酯的可固化树脂组合物固化产品电气和电子元件和电路板

摘要

Provided is a curable resin composition having high dielectric properties required for high-frequency electrical insulation material applications, providing a cured product excellent in low water absorption and low coefficient of linear expansion, and excellent in wiring embedding flatness and resin fluidity. This invention is aromatic polyester obtained by condensing (a) aromatic oxycarboxylic acid, (b) aromatic polyhydric carboxylic acid or aromatic polyhydric hydroxy compound, and (c) aromatic monohydroxy compound or aromatic monocarboxylic acid. Moreover, it is a curable resin composition containing the said aromatic polyester (A), the epoxy resin (D) which has two or more epoxy groups in 1 molecule, and a hardening accelerator (E).
机译:提供了一种可固化树脂组合物,具有高频率电绝缘材料应用所需的高介电性能,提供低吸水性和线性膨胀系数优异的固化产物,以及嵌入平坦度和树脂流动性优异。 本发明是通过冷凝(a)芳族羟基羧酸,(b)芳族多元羧酸或芳族多元羟基化合物,和(c)芳族单羟基化合物或芳族一元羧酸获得的芳族聚酯。 另外,含有上述芳族聚酯(A),环氧树脂(D)的可固化树脂组合物,其在1分子中具有两个或更多个环氧基团,以及硬化促进剂(E)。

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