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LED CHIP APPLIED TO DISPLAY SCREEN AND PREPARATION METHOD THEREFOR

机译:LED芯片应用于显示屏幕和制备方法

摘要

Provided in the present application are an LED chip applied to a display screen and a preparation method therefor. The LED chip comprises a substrate, an epitaxial sheet, a composite conductive layer, a first passivation layer, a P electrode, and an N electrode. The composite conductive layer comprises an ohmic contact layer and at least two transparent conductive layers, and the compactness of the at least two transparent conductive layers gradually decreases along a preset direction, so that once the at least two transparent conductive layers are etched, the distance from the side surface of the composite conductive layer near a first region to the first region gradually increases along the preset direction, and then an angle formed between the side surface of the composite conductive layer near the first region and the first region is enlarged, so that the value of the angle thereof is located within the range of 140 degrees to 160 degrees, so as to improve the coating performance of the side surface of the subsequent first passivation layer at the composite conductive layer once the first passivation layer is formed, thereby reducing the probability of breakage of the portion of the first passivation layer located at the side surface of the composite conductive layer, and improving the reliability of the LED.
机译:本申请中提供的是应用于显示屏的LED芯片和其制备方法。 LED芯片包括基板,外延片,复合导电层,第一钝化层,P电极和N电极。复合导电层包括欧姆接触层和至少两个透明导电层,并且至少两个透明导电层的紧凑性沿预设方向逐渐减小,从而蚀刻至少两个透明导电层,距离从第一区域的第一区域附近的复合导电层的侧表面沿预设方向逐渐增加,然后在第一区域和第一区域附近的复合导电层的侧表面之间形成的角度放大,因此其角度的值位于140度至160度的范围内,从而一旦形成第一钝化层,可以改善随后的第一钝化层的侧表面的侧表面,从而形成第一钝化层降低位于Th的侧面的第一钝化层的断裂概率复合导电层,提高LED的可靠性。

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