A junction structure and a switch, a photoelectric sensor, and a proximity sensor including the junction structure

摘要

A joint structure having excellent thermal shock resistance and high joint strength is provided. A bonding structure according to an embodiment of the present invention includes a first member made of a metal material in which a plurality of holes having an opening diameter of 30 to 100 μm are formed on the surface, and a plurality of independent holes having an opening diameter of 30 to 100 μm on the surface. A third member formed of the same or different metal material or thermoplastic resin as the first member, and a curable resin for joining the holed surface of the first member and the holed surface of the third member 2 members are provided.