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WAFER CENTER DETECTION METHOD AND WAFER CENTER DETECTION DEVICE

机译:晶圆中心检测方法和晶片中心检测装置

摘要

To provide a wafer center detection method and apparatus that are able to improve accuracy in detecting the center of a wafer.SOLUTION: A wafer center detection method includes: a wafer holding step; a positioning step of positioning an imaging unit 20 and a holding table 10 so that an outer edge 110 of a wafer 100 is imaged; an imaging step of, while rotating the holding table 10 within an arbitrary range of angle, imaging the outer edge 110 by means of the imaging unit 20 and recording a plurality of images in association with a rotation angle; an outer edge detection step of detecting a position of the outer edge 110 in each of these images; a coordinate acquisition step of acquiring coordinates of the outer edge 110 of the wafer 100 from the position of the outer edge 110 of each image and the rotation angle of the holding table 10 during imaging; and a central coordinate calculation step of calculating an approximate circle from the coordinates of the outer edges 110 and acquiring center coordinates of the wafer 100.SELECTED DRAWING: Figure 1
机译:为了提供一种能够提高检测晶片的中心的晶片中心检测方法和装置,可以提高晶片的中心:晶片中心检测方法包括:晶片保持步骤;定位成像单元20和保持台10的定位步骤,使得晶片100的外边缘110成像;一种成像步骤,同时将保持表10旋转在任意角度范围内,通过成像单元20对外边缘110成像并与旋转角度相关联地记录多个图像;在这些图像中的每一个中检测外边缘110的位置的外边缘检测步骤;从成像期间从每个图像的外边缘110的位置获取晶片100的外边缘110的坐标的坐标采集步骤,以及在成像期间保持表10的旋转角度;和一个中央坐标计算步骤,从外边缘110的坐标计算近似圆,并获取晶片100的中心坐标。选择图:图1

著录项

  • 公开/公告号JP2021125646A

    专利类型

  • 公开/公告日2021-08-30

    原文格式PDF

  • 申请/专利权人 DISCO ABRASIVE SYST LTD;

    申请/专利号JP20200019983

  • 发明设计人 TAKANORI YU;

    申请日2020-02-07

  • 分类号H01L21/68;H01L21/301;

  • 国家 JP

  • 入库时间 2022-08-24 22:20:01

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