首页> 外国专利> A METHOD FOR ELECTROLYTICALLY PASSIVATING A SURFACE OF SILVER, SILVER ALLOY, GOLD, OR GOLD ALLOY

A METHOD FOR ELECTROLYTICALLY PASSIVATING A SURFACE OF SILVER, SILVER ALLOY, GOLD, OR GOLD ALLOY

机译:一种电解钝化银,银合金,金或金合金表面的方法

摘要

The present invention relates to a method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy, the method comprising the steps of(i) providing a substrate comprising said surface,(ii) providing an aqueous passivation solution comprising trivalent chromium ions, andone or more than one species of carboxylic acid residue anions,(iii) contacting the substrate with said passivation solution and passing an electrical current between the substrate as a cathode and an anode such that a passivation layer is electrolytically deposited onto said surface,wherein the trivalent chromium ions with respect to all species of carboxylic acid residue anions form a molar ratio in the range from 1:10 to 1:400.
机译:本发明涉及一种用于电解钝化银,银合金,金或金合金表面的方法,该方法包括(i)的步骤,提供包括所述表面的基材,(II),提供包含三价的含水钝化溶液 铬离子,Andone或多于一种羧酸残基阴离子,(iii)与所述钝化溶液接触并将基板之间的电流作为阴极和阳极通过,使得钝化层被电解沉积在所述表面上 ,其中三价铬离子相对于所有物种的羧酸残基阴离子形成摩尔比在1:10至1:400的范围内。

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