首页> 外国专利> PREPARATION METHOD FOR INTERNAL PORE-FREE SPHERICAL SILICA POWDER FILLER, POWDER FILLER OBTAINED THEREBY, AND APPLICATION THEREOF

PREPARATION METHOD FOR INTERNAL PORE-FREE SPHERICAL SILICA POWDER FILLER, POWDER FILLER OBTAINED THEREBY, AND APPLICATION THEREOF

机译:内部孔隙球形二氧化硅粉末填料,由此获得的粉末填料的制备方法及其应用

摘要

Provided are a preparation method for an internal pore-free spherical silica powder filler, a spherical silica filler obtained thereby, and an application thereof. The method comprises: providing spherical polysiloxane by a hydrolytic condensation reaction of R 1SiX 3, the spherical polysiloxane comprising 80%-100% of a T unit, R 1 being a hydrogen atom or an independently selected organic group comprising 1-18 carbon atoms, X being a hydrolytic decomposable group, and the T unit being R 1SiO 3-; and calcining the spherical polysiloxane under an oxidizing gas atmosphere at a calcining temperature of 850°C-1200°C to obtain the internal pore-free spherical silica powder filler, the pore diameter of the internal pore ranging from 80 nanometers to 1/3 of the diameter of the spherical silica. The spherical silica powder filler is applicable to a high-density chip packaging structure required to be polished in 2.5D, 3D and other packaging processes.
机译:提供了一种用于内部孔隙球形二氧化硅粉末填料的制备方法,由此获得的球形二氧化硅填料及其应用。 该方法包括:通过R 1six 3的水解缩合反应提供球形聚硅氧烷,其包含80%-100%的T单元的球形聚硅氧烷,R 1是氢原子或包含1-18个碳原子的独立选定的有机基团, X是水解可分解组,T单位是R 1SIO 3-; 并在氧化气体气氛下煅烧球形聚硅氧烷在850℃-1200℃的煅烧温度下,得到内部孔隙球形二氧化硅粉末填料,内部孔径的孔径为80纳米至1/3 球形二氧化硅的直径。 球形二氧化硅粉末填料适用于需要在2.5D,3D和其他包装工艺中抛光的高密度芯片包装结构。

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