A method for producing a bonding agent in which a paraffin is dissolved in an dissolved solution dissolved in an organic solvent

摘要

On the cleaned junction surfaceThe bond surface is strongly bonded through the active state materialThe base and the parts can be bonded regardless of the roughness and flatness of the joining surface.It is unnecessary to remove impurities adsorbed on the junction surface.There are few restrictions on the material of the base material and the parts to be bonded.There is no restriction on the size, shape or weight of the bonded substrate or parts.No pretreatment between the base and the parts is necessary.Both bonding and joining methods are inexpensiveProblem to be solved: to provide a bonding method and a joining method of the bonding agent.Solution: a bonding agent in which a collection of fine particles of particles is dispersed in a solution dissolved in parabolodes in an organic solvent is produced.The bonding agent is applied to the bonding surface of one substrate 2 or the other component, the other substrate 3 or the other part is superposed, the compressive stress is applied to the superimposed substrate or part, and the temperature is raised to a temperature higher than the boiling point of paraffin in the nitrogen atmosphere. The base material or components are joined together.Diagram