A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body 20, equipped with: an IC module 30 having an IC chip 32 capable of performing contactless communication; a hinge layer 41 having a hinge section 41a which can be bound into a booklet; a non-hinge layer 42 which is laminated onto the hinge layer 41 and does not have a hinge part, wherein the hinge layer 41 is disposed over the entire surface of the laminated body 20 having the hinge, the hinge layer 41 and the non-hinge layer 42 have a housing hole 47 penetrating across the two layers, and the IC module 30 is housed and held inside the housing hole 47.
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