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SEMICONDUCTOR LEAD FRAME STAMPING DIE WITH IMPROVED PRODUCTION EFFICIENCY
SEMICONDUCTOR LEAD FRAME STAMPING DIE WITH IMPROVED PRODUCTION EFFICIENCY
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机译:半导体引线框架冲压模具提高了生产效率
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摘要
The present invention relates to a semiconductor lead frame stamping die with improved production efficiency and, more specifically, to a semiconductor lead frame stamping die with improved production efficiency, which can minimize the likelihood of occurrence of errors when producing a lead frame with fine tolerance, and can achieve rapid stamping.
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