首页> 外国专利> GLASS CORE WIRING SUBSTRATE WITH BUILT-IN HIGH-FREQUENCY FILTER, HIGH-FREQUENCY MODULE IN WHICH SAID GLASS CORE WIRING SUBSTRATE WITH BUILT-IN HIGH-FREQUENCY FILTER IS USED, AND METHOD FOR MANUFACTURING GLASS CORE WIRING SUBSTRATE WITH BUILT-IN HIGH-FREQUENCY FILTER

GLASS CORE WIRING SUBSTRATE WITH BUILT-IN HIGH-FREQUENCY FILTER, HIGH-FREQUENCY MODULE IN WHICH SAID GLASS CORE WIRING SUBSTRATE WITH BUILT-IN HIGH-FREQUENCY FILTER IS USED, AND METHOD FOR MANUFACTURING GLASS CORE WIRING SUBSTRATE WITH BUILT-IN HIGH-FREQUENCY FILTER

机译:玻璃芯布线基板具有内置高频滤波器,高频模块,其中使用具有内置高频滤波器的所述玻璃芯布线基板,以及制造具有内置高频的玻璃芯布线基板的方法 筛选

摘要

Provided are: a glass core wiring substrate with a built-in high-frequency filter in which a glass substrate with excellent high-frequency characteristics is used as a core material, and which promotes the efficient placement of a conductor within the glass substrate; a module in which said glass core wiring substrate with a built-in high-frequency filter is used; and a method for manufacturing a glass core wiring substrate with a built-in high-frequency filter. The structure is such that in forming of an electrically conductive layer inside a glass through hole 4 of a glass core substrate 1, there are formed a hollow tubular conductor layer formed on a side wall, and a lid-shaped conductor layer made to cover one of two openings, the hollow tubular conductor layer and the lid-shaped conductor layer being connected. As one means for realizing this structure, a carrier 15 is affixed to one surface of the glass core substrate 1 so as to shield one side of the opening of the glass through hole 4, and after lamination of a conductor, the carrier 15 is peeled and removed.
机译:提供:具有内置高频滤波器的玻璃芯布线基板,其中具有优异的高频特性的玻璃基板用作芯材,并促进导体在玻璃基板内的有效放置;其中所述玻璃芯布线基板使用具有内置高频滤波器的模块;以及具有内置高频滤波器的玻璃芯布线基板的制造方法。该结构使得在形成玻璃芯基板1的玻璃通孔4内的导电层,形成在侧壁上形成的中空管状导体层,并且盖形导体层制成一个盖子两个开口,中空管状导体层和盖形导体层连接。作为实现该结构的一种装置,载体15固定到玻璃芯基板1的一个表面,以便屏蔽玻璃通孔4的开口的一侧,并且在载体15的层压之后剥离并被删除。

著录项

  • 公开/公告号WO2021205986A1

    专利类型

  • 公开/公告日2021-10-14

    原文格式PDF

  • 申请/专利权人 TOPPAN INC.;

    申请/专利号WO2021JP14189

  • 发明设计人 MANIWA SUSUMU;

    申请日2021-04-01

  • 分类号H01F17;H01L23/12;H05K1/16;H05K3/46;H01F27;

  • 国家 JP

  • 入库时间 2022-08-24 21:43:13

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