Resin composition, sheet using the same, laminated body, power semiconductor device, plasma processing apparatus, and manufacturing method of semiconductor

摘要

(A) polyimide resin containing 60 mol% or more of diamine residues having a structure represented by the following general formula (1) in all diamine residues, (B) thermosetting resin and (C) thermally conductive filler 60 parts by volume of the (C) thermally conductive filler relative to a total of 100 parts by volume of the (A) polyimide resin, (B) thermosetting resin and (C) thermally conductive filler, which is a resin composition containing A resin composition containing the above. Provided is a resin composition which is excellent in heat resistance and thermal conductivity, and can obtain a sheet having a low elastic modulus and an excellent thermal response. [Chemical formula 1]