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Trench capacitor component with reduced equivalent series resistance and equivalent series inductance

机译:具有降低的等效串联电阻和等效系列电感的沟槽电容器组件

摘要

Certain aspects of the present disclosure generally relate to a capacitive element. One example capacitive element generally includes a substrate, a plurality of trench capacitors, an electrically conductive via, a first electrically conductive contact, and a second electrically conductive contact. The trench capacitors intersect the substrate. The electrically conductive via intersects the substrate and is disposed adjacent to at least one of the trench capacitors. The first electrically conductive contact is disposed above the substrate, and the second electrically conductive contact is disposed below the substrate and electrically coupled to the plurality of trench capacitors through the electrically conductive via.
机译:本公开的某些方面一般涉及电容元件。 一个示例电容元件通常包括基板,多个沟槽电容器,导电通孔,第一导电触头和第二导电接触。 沟槽电容器与基板相交。 导电通孔与基板相交,并且与至少一个沟槽电容器相邻地设置。 第一导电触点设置在基板上方,第二导电触点设置在基板下方并通过导电通孔电耦合到多个沟槽电容器。

著录项

  • 公开/公告号US11145768B2

    专利类型

  • 公开/公告日2021-10-12

    原文格式PDF

  • 申请/专利权人 QUALCOMM INCORPORATED;

    申请/专利号US202016782865

  • 发明设计人 JONGHAE KIM;PERIANNAN CHIDAMBARAM;

    申请日2020-02-05

  • 分类号H01L29/66;H01L29/94;H01L23/522;H01L27/08;H01L21/768;

  • 国家 US

  • 入库时间 2022-08-24 21:36:31

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