SECURITY CHIP, METHOD FOR MANUFACTURING SECURITY CHIP, AND ELECTRONIC DEVICE

摘要

A security chip, a method for manufacturing the security chip, and an electronic device, which can improve the security level of a security chip, reduce costs of the security chip, and improve the comprehensive performance of the security chip. The security chip comprises: a first chip, a second chip and a first light-blocking layer, wherein the first chip and the second chip are stacked one above the other, and are electrically connected to each other; and the light-blocking layer is close to a circuit region in the first chip, and is used for totally reflecting and/or scattering an external first optical signal that irradiates towards the circuit region in the first chip. In the present solution, the first chip and the second chip are respectively independently manufactured instead of the first chip and the second chip being integrated into the same chip for manufacturing, such that the manufacturing processes of the first chip and the second chip are decoupled, thereby reducing the manufacturing costs for the first chip and the second chip. In addition, a light-blocking layer is added in the security chip to totally reflect and/or scatter optical signals, such that the security performance of the chip is improved while the manufacturing costs are reduced.