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Device test pad probe card structure with individual probe manipulation capability
Device test pad probe card structure with individual probe manipulation capability
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机译:设备测试垫探头卡结构,具有个别探头操纵能力
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摘要
A test probe assembly for use in testing a semiconductor wafer includes a probe card, a plurality of test probes mounted to the probe card and one or more piezoelectric elements mounted to each test probe. The piezoelectric elements are configured to move respective probe ends of the individual test probes in at least one direction to facilitate realignment of the probe ends for semiconductor wafer testing.
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