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Interface circuit, chip containing interface circuit and manufacturing method thereof

机译:接口电路,包含接口电路的芯片及其制造方法

摘要

Disclosed is an interface circuit, a chip containing an interface circuit and a manufacturing method thereof. The interface circuit includes an I/O processing sub-circuit, a path selection sub-circuit, and at least two I/O ports. The I/O processing sub-circuit, the path selection sub-circuit, and the at least two I/O ports are electrically connected in sequence. The path selected by the path selection sub-circuit can enable a first and a second electrical signal to be transmitted through the I/O ports that are configured to correspond to the ports of the external device through which the first and second electrical signals are transmitted. That is, the path selection sub-circuit can customize the layout of the signal-input/output I/O ports of the interface circuit according to the layout of the ports of the external device.
机译:公开了一种接口电路,其包含接口电路的芯片及其制造方法。 接口电路包括I / O处理子电路,路径选择子电路和至少两个I / O端口。 I / O处理子电路,路径选择子电路和至少两个I / O端口依次电连接。 由路径选择子电路选择的路径可以使得能够通过被配置为对应于传输第一和第二电信号的外部设备的端口的I / O端口来传输第一和第二电信号。 。 也就是说,路径选择子电路可以根据外部设备的端口的布局来定制接口电路的信号输入/输出I / O端口的布局。

著录项

  • 公开/公告号US11140777B2

    专利类型

  • 公开/公告日2021-10-05

    原文格式PDF

  • 申请/专利权人 SHENZHEN SANDIYIXIN ELECTRONIC CO. LTD.;

    申请/专利号US201716076626

  • 发明设计人 XIANGBING CHEN;

    申请日2017-07-20

  • 分类号H05K1/02;H03K19/0175;

  • 国家 US

  • 入库时间 2022-08-24 21:25:57

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