首页> 外国专利> MATERIAL FOR LOCATING GAS LEAK, METHOD FOR LOCATING GAS LEAK, MATERIAL FOR REPAIRING GAS LEAK, METHOD FOR REPAIRING GAS LEAK, AND DEVICE FOR REPAIRING GAS LEAK

MATERIAL FOR LOCATING GAS LEAK, METHOD FOR LOCATING GAS LEAK, MATERIAL FOR REPAIRING GAS LEAK, METHOD FOR REPAIRING GAS LEAK, AND DEVICE FOR REPAIRING GAS LEAK

机译:用于定位气体泄漏的材料,用于定位气体泄漏的方法,修复气体泄漏的材料,修复气体泄漏的方法,以及修复煤气泄漏的装置

摘要

Provided is a material for locating gas leaks, which is for application to suspected gas leaks to locate a gas leak. If the viscosity of the material at 25°C and a shear rate of 0.1 s-1 is expressed by A (Pa·s) and the viscosity of the material at 25°C and a shear rate of 10 s-1 is expressed by B (Pa·s), then the relationship A/B≥21.0 is satisfied. The material, after having been cured, has a modulus E' at 50°C of 10 MPa or greater.
机译:提供了一种用于定位气体泄漏的材料,其用于涉及疑似气体泄漏以定位气体泄漏。 如果在25℃下的材料和0.1S-1的剪切速率的粘度由(Pa·s)表示,并且在25℃下的材料的粘度和10s-1的剪切速率 B(PA·S),那么满足关系A /B≥21.0。 在已经固化后的材料具有在10MPa或更高的50℃下的模量E'。

著录项

  • 公开/公告号WO2021192878A1

    专利类型

  • 公开/公告日2021-09-30

    原文格式PDF

  • 申请/专利权人 DEXERIALS CORPORATION;

    申请/专利号WO2021JP08327

  • 发明设计人 MORI YASUTAKA;KUBOTA TAKAAKI;ABE TETSUYA;

    申请日2021-03-04

  • 分类号C08F20/12;F16L55/175;F16L55/18;

  • 国家 JP

  • 入库时间 2022-08-24 21:24:48

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