THERMOELECTRIC SYSTEMS EMPLOYING DISTRIBUTED TRANSPORT PROPERTIES TO INCREASE COOLING AND HEATING PERFORMANCE

摘要

Thermoelectric systems employing distributed transport properties to increase cooling and heating performance are provided herein. In some examples, a thermoelectric heat pump is provided that includes a distributed transport properties (DTP) thermoelectric (TE) couple including at least one DTP TE element. The at least one DTP TE element includes a TE material with a Seebeck coefficient, thermal conductivity, or electrical resistance varying within said DTP TE element such that when that DTP TE element is subjected to a fixed temperature differential and no current is flowing in a primary direction that produces heat pumping action, at least at one position within that DTP TE element there is a current that in steady state operation produces a lower temperature than the temperature at that position when no current is flowing.