MOTHERBOARD ARRANGEMENT METHOD FOR IMPROVING COMPUTER PERFORMANCE AND MOTHERBOARD THEREOF

摘要

In view of the existing problems affecting computer performance due to poor CPU cooling, this disclosure provides a motherboard arrangement method for improving the performance of the computer and a motherboard thereof, CPU being arranged on the back side of the circuit board, memory slots, expansion slots, peripheral interfaces and other components being arranged on the front side of the circuit board. The heat generated by CPU is directly transferred into a space between the back side of the motherboard and the corresponding side of the case through the cooling fan, the effective cooling and insulation space is formed in the case. It is easy for air circulation, to exhaust hot air outside the case by the power fan, and to make the cold air outside the case inside to improve the cooling efficiency greatly.