Thermally softening addition curing type thermally conductive silicone composition

摘要

PROBLEM TO BE SOLVED: To provide a heat-softening addition-curing type heat conductive silicone composition having good room temperature storage property and capable of suppressing pumping out by addition curing. A thermoplastic organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups in one molecule (B) an organohydrogenpolysiloxane: an aliphatic unsaturated hydrocarbon in the component (A). Catalytic fine particles having a microcapsule structure in which the number of SiH groups is 0.3 to 5 relative to the number of groups, (C) a compound containing a platinum group metal catalyst is used as a core material, and a three-dimensional crosslinked polymer compound is used as a wall material: A composition containing a thermally conductive filler selected from the group consisting of an effective amount (D) metal or the like, and the uncured coating film formed from the composition has no fluidity at 25 ° C. and is 40 to 40 to A heat-softening addition-curable heat conductive silicone composition having the property of softening and flowing at a temperature of 100 ° C. [Selection diagram] None