METHOD FOR MEASURING AND CALIBRATING TEMPERATURE OF WAFER CHUCK, AND TEMPERATURE MEASUREMENT SYSTEM

摘要

Provided are a method for measuring and calibrating the temperature of a wafer chuck, and a temperature measurement system. The method comprises: placing a test wafer on a wafer chuck (S102); causing the temperature of the test wafer to reach a set temperature, by means of a plurality of semiconductor devices having an electric parameter undergoing function changes along with the temperature formed on the test wafer (S104); measuring the semiconductor devices to obtain the electric parameter corresponding to the semiconductor devices (S106); obtaining, according to the electric parameter and the function changes of the electric parameter along with the temperature, the actual temperature of the semiconductor devices (S108); and obtaining, according to the actual temperature of the semiconductor devices, the actual temperature distribution of the wafer chuck (S110).