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GUIDE RAIL GRINDING DEVICE, GUIDE RAIL GRINDING METHOD, AND METHOD FOR ADJUSTING GUIDE RAIL GRINDING DEVICE

机译:导轨研磨装置,导轨研磨方法和调节导轨磨削装置的方法

摘要

Provided are a guide rail grinding device capable of grinding a guide rail in a more stable manner, a guide rail grinding method, and a method for adjusting the guide rail grinding device. A guide rail grinding device (1a) is provided with a grinding unit (4) and a traveling support body (3a). The grinding unit (4) has a grinding means. The grinding means grinds a to-be-ground surface of a guide rail (2) in contact with said to-be-ground surface. The traveling support body (3a) has a first holding means and a guide means. The first holding means holds the grinding unit (4) so as to keep a relative positional relationship with the grinding unit (4). The guide means guides the grinding unit (4) in contact with the guide rail (2) such that the grinding unit (4) is moved in a first direction along the to-be-ground surface. In the traveling support body (3a), the first holding means is provided to a front end part forward in the first direction relative to the guide means.
机译:提供了一种导轨研磨装置,其能够以更稳定的方式研磨导轨,导轨研磨方法和用于调节导轨研磨装置的方法。 导轨研磨装置(1A)设置有研磨单元(4)和行进支撑体(3A)。 研磨单元(4)具有研磨装置。 研磨装置将导轨(2)的待接地表面研磨与所述待接地表面接触。 行进支撑体(3a)具有第一保持装置和引导装置。 第一保持装置保持研磨单元(4),以便与研磨单元(4)保持相对位置关系。 引导装置引导与导轨(2)接触的研磨单元(4),使得研磨单元(4)沿着待接地表面沿第一方向移动。 在行进支撑体(3A)中,第一保持装置相对于引导装置在第一方向上向前部部分设置到前端部。

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