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GUIDE RAIL GRINDING DEVICE, GUIDE RAIL GRINDING METHOD, AND METHOD FOR ADJUSTING GUIDE RAIL GRINDING DEVICE
GUIDE RAIL GRINDING DEVICE, GUIDE RAIL GRINDING METHOD, AND METHOD FOR ADJUSTING GUIDE RAIL GRINDING DEVICE
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机译:导轨研磨装置,导轨研磨方法和调节导轨磨削装置的方法
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摘要
Provided are a guide rail grinding device capable of grinding a guide rail in a more stable manner, a guide rail grinding method, and a method for adjusting the guide rail grinding device. A guide rail grinding device (1a) is provided with a grinding unit (4) and a traveling support body (3a). The grinding unit (4) has a grinding means. The grinding means grinds a to-be-ground surface of a guide rail (2) in contact with said to-be-ground surface. The traveling support body (3a) has a first holding means and a guide means. The first holding means holds the grinding unit (4) so as to keep a relative positional relationship with the grinding unit (4). The guide means guides the grinding unit (4) in contact with the guide rail (2) such that the grinding unit (4) is moved in a first direction along the to-be-ground surface. In the traveling support body (3a), the first holding means is provided to a front end part forward in the first direction relative to the guide means.
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