首页> 外国专利> ANALYSIS CHIP MANUFACTURING APPARATUS, METHOD FOR OPERATING ANALYSIS CHIP MANUFACTURING APPARATUS, AND ANALYSIS CHIP MANUFACTURING METHOD

ANALYSIS CHIP MANUFACTURING APPARATUS, METHOD FOR OPERATING ANALYSIS CHIP MANUFACTURING APPARATUS, AND ANALYSIS CHIP MANUFACTURING METHOD

机译:分析芯片制造设备,操作分析芯片制造装置的方法,以及分析芯片制造方法

摘要

An analysis chip manufacturing apparatus according to the present invention comprises: a rotary table that rotates around a central axis, and upon which substrates, that have not been coated with a selectively bondable material, are placed; a point-application head that comprises a plurality of point-application members that point-apply the selectively bondable material to raised parts, and are capable of moving in a scanning plane; and a control unit that controls, for each substrate, the rotation of the rotary table, the movement of the point-application head in the scanning plane, and the application of the selectively bondable material to the raised parts on the substrate. The control unit rotates the rotary table and/or moves the point-application head to a position such that the point-application members and the raised parts of the substrate corresponding to each of the point-application members overlap when viewed from the direction of the central axis of the rotary table, and causes the selectively bondable material to be applied to the raised parts.
机译:根据本发明的分析芯片制造装置包括:放置围绕中心轴线旋转的旋转台​​,并且在尚未用选择性可粘合材料涂覆的基板上旋转;点施加头,其包括多个点应用构件,该点施加构件将选择性可粘合材料指向升高的部件,并且能够在扫描平面中移动;对于每个基板,旋转台的旋转,旋转台的旋转,在扫描平面中的移动,以及将可选择性可粘合材料施加到基板上的凸起部分中的升降部件的控制单元。控制单元旋转旋转台和/或将点施加头移动到位置,使得点施加构件和与每个点应用构件的基板的凸起部分在从方向上观察时重叠。旋转台的中心轴,并使可选择性的可粘合材料施加到凸起的部件上。

著录项

  • 公开/公告号WO2021182434A1

    专利类型

  • 公开/公告日2021-09-16

    原文格式PDF

  • 申请/专利权人 TORAY INDUSTRIES INC.;

    申请/专利号WO2021JP09148

  • 发明设计人 TAKII YUKI;NAGINO KUNIHISA;

    申请日2021-03-09

  • 分类号G01N37;C12M1;G01N35/10;C12N15/09;G01N33/53;

  • 国家 JP

  • 入库时间 2022-08-24 21:07:49

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