首页>
外国专利>
LANDING PAD APPARATUS FOR THROUGH-SILICON-VIAS
LANDING PAD APPARATUS FOR THROUGH-SILICON-VIAS
展开▼
机译:用于通过硅通孔的着陆垫装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
An apparatus is provided which comprises: a plurality of interconnects to couple a silicon interposer to a substrate; and a landing pad configured in a non-circle shape, wherein the plurality of interconnects are adjacent to the landing pad at one end of the plurality of interconnects through a plurality of vias.
展开▼