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Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite

机译:微尺寸惯性导航传感器套件的单片封装的方法和装置

摘要

A device preferably for use in an inertial navigation system the device having a single IC wafer; a plurality of sensors bonded to bond regions on said single IC wafer, at least one of said bond regions including an opening therein in gaseous communication with a pressure chamber associated with at least one of the plurality of said sensors; and a plurality of caps encapsulating said plurality of sensors, at least one of said plurality of caps forming at least a portion of said pressure chamber. A method of making the device is also disclosed.
机译:优选用于具有单个IC晶片的装置的惯性导航系统的装置; 多个传感器粘合到所述单个IC晶片上的粘合区域,所述粘合区域中的至少一个包括其中的开口,其在气态连通中与与所述多个所述传感器中的至少一个相关的压力室; 和封装所述多个传感器的多个盖子,所述多个帽中的至少一个形成所述压力室的至少一部分。 还公开了一种制造该装置的方法。

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