Seam drilling compounding with epoxy resin and its molding

摘要

Problem to be solved: to provide a seam molding compound and an molded product using an epoxy resin excellent in SMC formability, heat resistance, long-term storage stability and productivity.A sheet molding compound characterized by filling the epoxy resin composition having the following components (a) to (E) with a reinforcing fiber containing a reinforcing fiber and filling the following (I).Component (a): epoxy resin, component (b): curing agent, component (c): polyisocyanate compound, component (d): silicone oil compound, component (E): surfactant.(I)When the epoxy resin composition is cured, the glass transition temperature is above 120 ° C.(2) the pH (PH) value measured by the pH meter is 4.0 or more and 8.0 or less.No selection