首页> 外国专利> Laminate, metal foil laminated laminate, laminated body with patterned metal foil, laminate having build-up structure, printed wiring board, multilayer coreless substrate, and its manufacturing method

Laminate, metal foil laminated laminate, laminated body with patterned metal foil, laminate having build-up structure, printed wiring board, multilayer coreless substrate, and its manufacturing method

机译:层压板,金属箔层压层压层压层压层压,带图案金属箔的层压体,层压板具有积聚结构,印花布线板,多层无芯基材及其制造方法

摘要

The laminate of the present invention isThe first resin composition layer andHeat resistant film layerThe second resin composition layer andIs a laminate stacked in this order;The first resin composition layer is semi cured (B stage);The difference between the maximum thickness and the minimum thickness of the first resin composition layer is0.5 to 5 μ AndThe second resin composition layer is semi cured (B stage);The difference between the maximum thickness and the minimum thickness of the second resin composition layer is0.5 to 5 μ M.
机译:本发明的层压材料是第一树脂组合物层和耐热膜层第二树脂组合物层和依次堆叠的层压板;第一树脂组合物层是半固化(B级);最大厚度和最小厚度之间的差异 第一树脂组合物层为0.5至5μ,第二树脂组合物层是半固化(B阶段);第二树脂组合物层的最大厚度和最小厚度之间的差异为0.5至5μm。

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