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Process for producing a layer based on aluminum nitride (AlN) on a structure based on silicon or III-V materials

机译:基于硅或III-V材料的结构基于氮化铝(ALN)的层的方法

摘要

Title: Method for producing a layer based on aluminum nitride (AlN) on a structure based on silicon or on III-V materials The invention relates to a method for producing a layer based on nitride of aluminum (AlN) on a structure based on silicon (Si) or based on a III-V material, the method comprising several deposition cycles (1) carried out in a plasma reactor (200) comprising a reaction chamber (210 ) inside which is disposed a substrate (70) comprising said structure, each deposition cycle (1) comprising at least the following steps: deposition (10) of aluminum-based species on an exposed surface (70a ) of the structure, the deposition step comprising at least one injection into the reaction chamber (210) of an aluminum-based precursor (Al), nitriding of the exposed surface (70a) of the structure, the nitriding step comprising at least one injection into the reaction chamber (210) of a nitrogen-based precursor (N) and the form ation (32) in the reaction chamber (210) of a nitrogen-based plasma, During the formation (32) of the nitrogen-based plasma, a bias voltage Vbias is applied to the substrate (70) not nothing. Figure for the abstract: Fig.3B
机译:标题:基于硅或III-V材料的结构上基于氮化铝(ALN)的层的制造方法,本发明涉及一种基于硅(ALN)氮化物的层的制造层的制造方法(Si)或基于III-V材料,该方法包括在等离子体反应器(200)中进行的多个沉积循环(1),其包括内部的反应室(210),所述反应室(210)设置在包括所述结构的基板(70)中,每个沉积周期(1)包括至少以下步骤:在结构的暴露表面(70a)上的铝基物质的沉积(10),所述沉积步骤包括至少一个注射到所述反应室(210)中基于铝的前体(A1),结构的暴露表面(70A)的氮化,氮化步骤包括至少一个注射到基于氮的前体(N)和形状的反应室(210)中(32 )在氮气-b的反应室(210)中在氮基等离子体的形成(32)期间,施加在氮气基等离子体期间,偏置电压Vbias被施加到基板(70)上并非没有。摘要图:图3B

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