AGPDCU ALLOY AND PREPARATION METHOD THEREFOR, AND AGPDCU ALLOY SPUTTERING TARGET MATERIAL AND PREPARATION METHOD THEREFOR

摘要

Disclosed are an AgPdCu alloy and a preparation method therefor, and an AgPdCu alloy sputtering target material and a preparation method therefor. The AgPdCu alloy comprises the following components by atomic percentage: 0.1-1.5% of Pd; 0.1-1.5% of Cu; and 97-99.8% of Ag. It has been demonstrated through experiments that when the AgPdCu alloy of the above-mentioned technical solution is used as a sputtering target material, the oxidation resistance of the AgPdCu alloy sputtering target material can be improved.